2.5D and 3D Fabrication
Airbridge Routing for Compact Quantum Circuits
iQnite offers 2.5D and 3D superconducting fabrication solutions for quantum devices requiring complex signal routing, compact layouts, and multilayer integration.
Our aluminum airbridge process enables crossover routing and ground-plane connection in planar superconducting circuits, improving layout flexibility for CPW resonators, qubits, and microwave circuits.
Superconducting Flip-Chip Bonding
Together, iQnite’s 2.5D and 3D capabilities enable customized QPUs and superconducting quantum devices with advanced routing, vertical integration, and scalable circuit architectures.
Indium Microbumps
Superconducting flip-chip bonding for 3D device integration.
>99.9% Yield
High microbump yield for reliable chip-to-chip interconnects.
8-10 μm Gap Control
Precise chip-to-chip spacing with minimal sample tilting.
Scalable QPU Architectures
Supports advanced routing, vertical integration, and custom superconducting devices.